shi@bonnie.ics.uci.edu (E. Shi) (01/06/89)
I understand there are several companies pursuing technologies to design very high-density hybrid circuits. Many large ICs could sit on these hybrid circuits and thus handle many of the interconnect problems typically associated with large systems. Some companies that are working on these technologies are RAYCHEM, UNISYS, HONEYWELL. Anybody hear of others. I heard that DEC may have brought the old TRILOGY operations for their technology. thanks ed :x