dmp@epg.harris.com (Donald Patterson) (10/17/90)
I am in the beginning stages of writing an expert system which would "design around" potential failures due to thermal mismatch. As part of the knowledge engineering task, I am interested in 1) Information about a failure or reliability problem known to be (at least partially) attributable to coefficient of thermal expansion (CTE) mismatch. 2) How the problem was resolved 3) Any other "tricks of the trade" regarding electronics design to circumvent these problems Response by E-mail is appreciated, but posting response is fine. Thanks in advance... ---------------------------------------------------------------------------- Don Patterson \\\ INTERNET : dmp@epg.harris.com Harris Corporation \\\ UUCP : ...!uunet!x102a!dpatterson Engineering Productivity Group \\\ VOICE : (407) 727-6058
mark@mips.COM (Mark G. Johnson) (10/18/90)
In article <4553@trantor.harris-atd.com> dmp@epg.harris.com (Donald Patterson) writes: > ... an expert system which would "design around" potential failures > due to thermal mismatch. One source of data is Bob Widlar, linear designer extrordinaire. He takes up the problem of unintentional voids in the thermal attachment: Robert J. Widlar, "Controlling Secondary Breakdown of Bipolar Power Transistors," Digest of Technical Papers, International Solid-State Circuits Conference (ISSCC) 1981, pp. 44-45. R. J. Widlar and M. Yamatake, "A 150W Opamp", ISSCC 1985, pp. 140-141. -- -- Mark Johnson MIPS Computer Systems, 930 E. Arques M/S 2-02, Sunnyvale, CA 94086 (408) 524-8308 mark@mips.com {or ...!decwrl!mips!mark}