shi@bonnie.ics.uci.edu (E. Shi) (01/06/89)
...with regards to high-density substrates to handle the
interconnect problem, I understand some companies are
doing some very unique things.
some companies I hear of include UNISYS, HONEYWELL...
also, anybody know if DEC really brought the old TRIOLOGY
operations for its technology in high-density substrates --
also known as WSI.
anybody have details on this?
-ed