[comp.arch] interconnect tech/wsi

shi@bonnie.ics.uci.edu (E. Shi) (01/23/89)

  I understand a number of companies are pursueing interesting
  ideas on handling the chip interconnect problem and thus avoiding
  problems inherent in WSI.

  for instance, unisys in rancho bernardo refers to their technology
  as  "SCAMP" I believe and Raychem in San Jose refers to it as "HDI"
  which stands for "High Density Interconnect".  Other publications
  refer to them as MCM for "Multi-Chip Modules."

  can any body shed some light on some of the physical/electrical characteristic  as well as the futures of the technology ie chip-on-board.

 thanks
  -ed