shi@bonnie.ics.uci.edu (E. Shi) (01/23/89)
I understand a number of companies are pursueing interesting ideas on handling the chip interconnect problem and thus avoiding problems inherent in WSI. for instance, unisys in rancho bernardo refers to their technology as "SCAMP" I believe and Raychem in San Jose refers to it as "HDI" which stands for "High Density Interconnect". Other publications refer to them as MCM for "Multi-Chip Modules." can any body shed some light on some of the physical/electrical characteristic as well as the futures of the technology ie chip-on-board. thanks -ed