[net.aviation] Headsets and InterComms

rje@cae780.UUCP (Bob Evans) (03/12/86)

The recent discussion on the difference between electret and dynamic
mikes brought to mind the discussion I had with the local aviation
parts supplier when I went to purchase an intercomm. He asked me
what type headsets I had, saying that it did make a difference
'sometimes'. Well, when I got my first headset I got a Telex D-950.
Its a nice, comfortable, affordable piece of gear. When I got my
second headset, I got the D/C H10-80, with the liquid ear seals. This
is a _nice_, _very comfortable_, not so affordable piece of gear ;-) .
The dealer indicated that mixing electret and dynamic mikes could 
(sometimes) lead to problems with distortion. He also said that
the problem was 'more prevalent with Telex intercomms' than with
the other gear he carried from Oregon Electronics (I think that is
the right name). A customer indicated that he had both types (!) of
intercomms and had no trouble with either set when mixing mike types,
but one of his friends had the Telex  and did have problems ...

I bought the Telex, and have not had distortion problems when mixing
mike types. I have not had any problems with volume levels either (maybe).
What I do notice is that the dynamic mike triggers the squelch circuit
faster and more easily than the electret mike does. This means that 
The person wearing the electret mike needs to put some oomph ! into
the first syllable - after that it works ok. Of course if you are replying
to something said by the person wearing the dynamic mike the shut off
delay is long enough to make everything work just fine.

I'm not an Electrical Engineer, just a software type ... does anyone know
what is going on here ?

By the way, I like both the Telex headset and intercomm and the
D/C H10-80 headset. The H10-80 _is_ quieter, if for no other reason
than the liquid ear seals (which work great around the glasses frames).

The usual disclaimers apply - I'm only a (mostly) satisfied, if somewhat
puzzled, user of the goods in question.


FROM:   Robert J. Evans, CAE Systems Division of Tektronix, Inc.
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