JLACOSS@USC-ISIB (12/29/82)
From: Jeff La Coss <JLACOSS@USC-ISIB> I have to consider the unappetizing possibility of making a custom high-density memory array out of high-speed RAMs in leadless chip carriers. Most of the LCCs that I've seen have their leads available only on the bottom of the package, requiring either sockets (ruining the density) or reflow soldering. Does anyone out there know about reflow soldering and/or who to talk to? Also, does anyone out there know of any short-run or fast-turnaround multi-layer PC board houses? Preferably suggested people will be in the LA area, but I'm open to trans-continental dealings. Thanks, Jeff -------