[comp.protocols.misc] HOT CHIPS SYMPOSIUM III

mfreeman@cascade.Stanford.EDU (Martin Freeman) (06/05/91)

           Just When You Thought It Was Safe To Go On Vacation:

                         HOT CHIPS SYMPOSIUM III
                  A Symposium on High-Performance Chips
                            (Advance Program)
 
                 Sponsored by the IEEE Computer Society
                 Technical Committee on Microprocessors

               Stanford University, Palo, Alto, California
                           August 26-27, 1991

Attend HOT Chips III, a symposium on high-performance chips, which will bring
together researchers and developers of chips used to construct high-performance
workstations and systems. Enjoy the informal format offering interaction with
speakers. This first two HOT Chips Symposiums were huge successes and prompted
articles in three special issues of IEEE Micro magazine. This year's HOT Chips
III will again bring you the latest developments in chip technology.

ORGANIZING COMMITTEE

General Chairman:            Martin Freeman, Philips Research
Program Co-Chairmen:         Forest Baskett, Silicon Graphics
                             John Hennessy,  Stanford University
Finance Chairman:            Hasan AlKhatib, Santa Clara University
Registration Chairman:       Robert Stewart, Stewart Research
Publication Chairman:        Nam Ling, Santa Clara University
Publicity Chairman:          Andrew Goforth, NASA Ames Research Center
Local Arrangements Chairman: Robert Stewart, Stewart Research


PROGRAM COMMITTEE

Forest Baskett, Silicon Graphics (Program Co-Chair)
John Crawford, Intel
David Ditzel, Sun Microsystems
John Hennessy, Stanford University (Program Co-Chair)
John Mashey, MIPS Computer Systems
Teresa Meng, Stanford University
Alan Smith, U.C. Berkeley

PROGRAM

August 26, 1991 - Dinkelspiel Auditorium


7:30 - 8:30	Onsite Registration

8:30 - 8:45	Welcome and Opening Remarks
		Martin Freeman, General Chair
  		Forest Baskett and John Hennessy, Program Co-Chairs

8:45 - 10:15	High-Performance Processors - I
		
		. Viking: A Superscalar SPARC Processor
		  Greg Blanck, Sun Microsystems &
		  Steve Krueger, Texas Instruments

		. R4000 Technical Overview
      		  Tom Riordan, MIPS Computer Systems

		. High-Performance PA-RISC Processor for "Snakes" Workstation
		  Mark Forsyth, Charles Kohlhardt, &
                  Ruby Lee, Hewlett Packard

10:15 - 10:45	BREAK

10:45 - 12:15	Highly Parallel Chips

		. The LIFE Family of High-Performance Single Chip VLIWs
		  Gerrit Slavenburg, Philips Research Palo Alto

		. The Message-Driven Processor
		  William Dally, J. Stewart Fiske, Waldemar Horwat, 
		  John Keen, Richard Lethin, Michael Noakes, & Peter Nuth
              	  MIT Artificial Intelligence Laboratory
		  D. Scott Wills
		  University of Central Florida
		  Andrew Chien
		  University of Illinois
		  Salim Ahmed, Paul Carrick, Roy Davison, Greg Fyler, 
		  Steve Lear, Mark Vestrich, & Ted Nguyen
		  Intel

		. The TRW CPUAX Superchip: A 4.1 Million Transistor CMOS CPU
		  A. Miscione, R. Almeida, H. Hennecke, & R. Mann
		  TRW Micro Electronics

12:15 - 1:45	LUNCH

1:45 - 3:15	High-Performance Processors - II

		. An 80 MHz 64-Bit Floating Point RISC Processor with
		  Direct DRAM Support
		  James Hesson, Micron Technology

		. The 80860XP: 2nd Generation of the i860(tm) RISC
		  Processor Family
		  David Perlmutter & Michael Kagan, Intel Israel

		. Beyond Claims of Free Transistors and Abundant
		  Instruction-Level Parallelism
		  Michael Smith, Stanford University

3:15 - 3:45	BREAK

3:45 - 5:15	Low Power and Low Cost

		. SPARC System Chipset
		  Greg Favor, Tera Microsystems
		
		. The SparKIT Chipset: How to Clone a Sparcstation
		  Mohammed Wasfi, LSI Logic Corporation

		. SMM, The "Virtual 386(tm)"
		  Dave Vannier, Intel

5:15 - 7:15	RECEPTION

7:30		EVENING PANEL SESSION: "Five Instructions Per Clock:
		Truth or Consequences"
		Alan Smith, U.C. Berkeley
		John Mashey, MIPS Computer Systems


August 27, 1991 - Dinkelspiel Auditorium


8:00 - 9:00	Onsite Registration

9:00 - 10:30	Communications

		. A GaAs 200 Mbps 64x64 Crosspoint Chip
		  Ron Cates, Vitesse Semiconductor

		. RN1: Low-Latency, Dilated, Crossbar Router
		  Henry Minsky, Tom Knight, Andre' DeHon

		. The NEURON Chip Family Architecture
		  Robert Dolin, Echelon

		. The Protocol Engine Chipset
		  Greg Chesson, Silicon Graphics

10:30 - 11:00	BREAK

11:00 - 12:30	Caches and Floating Point
	
		. R4000 Cache Design Tradeoffs and Performance
		  Earl Killian, MIPS Computer Systems

		. The Megacell Differentiated Floating Point Product Family
		  Merrick Darley, Don Steiss, Peter Groves, David Bural,
		  Maria Gill, & Tod Wolf
		  Texas Instruments

		. High-Integration 2nd Level Cache for the i486 CPU
		  Adi Gobert, Intel Corporation

12:30 - 2:00	LUNCH

2:00 - 3:30	Special Processors

		. C-Cube CL950 MPEG Video Decoder/Processor
		  Stephen Purcell, C-Cube Microsystems

		. A Smart Frame Buffer
		  Joel McCormack, DEC Western Research Laboratory

		. A High-Performance, Low-Cost Neural Chip
		  Gary Tahara, Inova Microelectronics

3:30 - 4:00	BREAK	


4:00 - 5:30	High-Performance Processors - III

		. National's Swordfish - A Superscalar with DSP
		  Reuven Marko & Motti Beck, National Semiconductor

		. H1: A Superscalar Pipelined CPU
		  Bob Krysiak, Richard Forsythe & Roger Sheperd
		  INMOS Ltd.

		. The Pinnacle SPARC Module
		  Raju Vegeshna, Ross Technology
		
5:30		Closing Remarks


HOUSING INFORMATION

Housing is available on the Stanford University campus in Stern Hall, a short
walk from Dinkelspiel Auditorium where the symposium will be held. Housing
is in student residences with central lavatory facilities and costs $40 per
night. A key deposit is required that will be refunded at checkout. Housing
arrangements on the Stanford campus must be mase by July 26.

Housing is also available at numerous hotels and motels on the peninsula in
Palo Alto, Menlo Park, Mountain View, and Los Altos close to Stanford
University.

If you would like additional housing information, please check the housing
information request box on the registration form.

QUESTIONS?

For more information on registration and local arrangements contact Dr. Robert
Stewart at (415) 941-6699 or r.stewart@compmail.com (use email after
June 1).

REGISTRATION FEES

                                     Postmarked by           Subsequent
                                        July 26             Registration

IEEE Computer Society                   $170                   $240
or ACM Member        

Non-Member                              $240                   $290

Full-Time Student                       $75                    $100


Instead of payment by check, registration may be charged to VISA or MasterCard.
Registration charged to a credit card may be FAXed to Dr. Robert Stewart at
(415) 941-6699.

REGISTRATION INCLUDES

* Attendance                        * Sunday evening wine & cheese reception
* One copy of the notes             * Monday evening reception
* Two luncheons                     * Coffee breaks
* Parking at Florence Moore Hall

On-site registration is available Sunday evening at the wine and cheese 
reception, and each morning at the symposium.

WINE & CHEESE RECEPTION

* Sunday, August 25 --- 5:00-7:00 PM
* Rodin Gardens, Stanford University
* A guided tour of the statuary will be provided.


=============================================================================


                      HOT CHIPS III REGISTRATION FORM


Name________________________________________________________________________

Affiliation_________________________________________________________________

Address_____________________________________________________________________

City/State/Zip______________________________________________________________

Country_____________________________________________________________________

Area Code/Phone #___________________________________________________________

Email Address_______________________________________________________________

Membership:       IEEE______          ACM_______

Membership Number___________________________________________________________

Check One:

______Check drawn on a U.S. Bank                    ______MasterCard
      Make Check Payable To:
      Hot Chips Symposium                           ______VISA

Name on Credit Card_________________________________________________________

Credit Card #_______________________________________________________________

Expiration Date_____________________________________________________________

Signature___________________________________________________________________

Amount Enclosed_____________________________________________________________

Mail To:

			Dr. Robert G. Stewart
			Stewart Research Enterprises
			1658 Belvoir Drive
			Los Altos, CA  94024


______Housing Information Requested