[rec.ham-radio] How do FETs REALLY work?

collinge@uvicctr.UUCP (Doug Collinge) (01/26/89)

OK, net, here's a question for you:

I know what a real MOSFET looks like and I have a vague notion of how it
works but how about this:  Say we get a piece of, say, N type silicon and
we oxidize it and stick on a gate.  Now we etch the Si so that it is very
thin under the gate.  Is this thing now a MOSFET even though there is no
junction nearby?  Does the MOSFET actually need the junction between the
substrate and the channel?

Next step: replace the semiconductor with a metal (Making a MOMFET!) -
increasing the gate voltage to a sufficiently high level should eventually
drive away all the free electrons rendering the channel an insulator.
What field strength would this require?

Lastly:  for my own arcane reasons I am interested in actually making a
transistor.  I don't want to have to make ultrapure silicon - is there
some other semiconductor (e.g., copper oxide) that would be easier to
use?  I don't care if it is a good transistor; gains of around 10 would
be just fine.

While we are at it:  I read somewhere that when junction transistors were
perfected research on point-contact transistors ceased and that they are
still poorly understood.  Is this true?  If not, how do they work?
-- 
		Doug Collinge
		School of Music, University of Victoria,
		PO Box 1700, Victoria, B.C., Canada,  V8W 2Y2  
		collinge@uvunix.BITNET
		decvax!uw-beaver!uvicctr!collinge
		ubc-vision!uvicctr!collinge
		__... ...__  _.. .  ..._ . __... __. _. .._  ..._._

nusip@maccs.McMaster.CA (Mike Borza) (01/31/89)

In article <609@uvicctr.UUCP> collinge@uvicctr.UUCP (Doug Collinge) writes:
>  Say we get a piece of, say, N type silicon and
>we oxidize it and stick on a gate.  Now we etch the Si so that it is very
>thin under the gate.  Is this thing now a MOSFET even though there is no
>junction nearby?  Does the MOSFET actually need the junction between the
>substrate and the channel?

Hmmm, interesting question.  Presumably, you're proposing to etch the
Si back from the opposite side that you've just metallized.  In
principle, you could do this, but in practice, you'd have a very
hard time controlling the characteristics of the device.  The problem
is that leakage along the exposed face would be very high-- you'd have
a quite nonlinear, very noisy resistor.  It's highly unlikely you'd be
able to "pinch" the channel off, hence you'd have (virtually) no
transistor action.  You don't need the junction with the substrate 
(sometimes called the "back gate") to have a MOSFET... this is similiar
to the structure of semiconductor-on-insulator (SOI) transistors.
>
>Next step: replace the semiconductor with a metal (Making a MOMFET!) -
>increasing the gate voltage to a sufficiently high level should eventually
>drive away all the free electrons rendering the channel an insulator.
>What field strength would this require?

Now you're in trouble!  You can fabricate useful devices in semiconductors
because the mobile charge in specific volumes of space can be controlled
quite accurately.  Trying to fabricate a device in which you control
the charge flowing laterally in a metal under the control of a "vertical"
electric field presents many practical problems.  First, the electric
field rises very quickly as a function of distance in a metal as charge
is forced away from its surface.  This presents one of (at least) two
practical problems.  Either you need a layer of metal which is no more
than a few interatomic distances thick (say about a hundred Angstroms),
or an insulator which can withstand huge electric fields without
breaking down electrically.  In fact, the space-charge in a metal
drops to its equilibrium value exponentially as a function of distance
into the metal, so the second possibility is out of the question.
Unfortunately, the atoms in extremely thin layers of metal have a tendency
to move under the influence of applie electric field, eventually
causing the failure of your device  There are other practical macroscopic
problems which would be observed, and undoubtedly some interesting
quantum-mechanical ones in a layer this thin, as well.
>
>Lastly:  for my own arcane reasons I am interested in actually making a
>transistor.  I don't want to have to make ultrapure silicon - is there
>some other semiconductor (e.g., copper oxide) that would be easier to
>use?  I don't care if it is a good transistor; gains of around 10 would
>be just fine.

This goes back a ways, but if I remember this right, Lillenfield (or some
similar name) applied for a patent around the turn of the century for
a field controlled resistor using aluminum oxide.  I'll try to dig up
a reference to this, but undoubtedly someone else has this at the tip
of their tongue (or fingers).
>
>While we are at it:  I read somewhere that when junction transistors were
>perfected research on point-contact transistors ceased and that they are
>still poorly understood.  Is this true?  If not, how do they work?
sorry, no time for that one now...
>-- 
>		Doug Collinge
>		collinge@uvunix.BITNET

mike borza <nusip@maccs.uucp or antel!mike@maccs.uucp>

dbraun@cadavr.intel.com (Doug Braun ~) (02/01/89)

One of the Scientific American "Amateur Scientist" columns,
from the early '70s, I think, described how to make a crude FET.

It noted that people almost discovered FETS long before the Bell Labs
transistor.


Doug Braun				Intel Corp CAD
					408 765-4279

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