[comp.edu] Call for Papers: Int. Conf. on Simulation in Eng. Education

eerdvak@engvms (06/26/91)

                           CALL FOR PAPERS 
  1992 International Conference on Simulation in Engineering Education
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       Sponsored by SCSI, (ASEE and IEEE sponsorships are pending)
      January 20-22, 1992 (part of the 1992 Western Multiconference)
                      Newport Beach, California

The conference provides a forum for the exchange of ideas and experience
 between educators in all the engineering disciplines.  With this idea 
in mind, papers should be planned so as to emphasize the impact of the
simulation approach, the advantages gained and the problems addressed.  
The aim should be to encourage and assist other educators, not necessarily 
from the same engineering discipline, to exploit the benefits of using
simulation in their own programs.  Papers which concentrate on the technical 
details of a particular application used in an educational context are also 
acceptable.  Suggestion for panel discussions and workshops are encouraged.

Topics of interest include, but are not limited to:
    . Simulation Languages and packages in engineering education
    . Techniques and systems used in teaching simulation
    . Relationship of software packages and engineering education
    . Case studies applying simulation techniques for engineering education
    . Graphics and animation for engineering simulation
    . Real time simulation techniques for engineers
    . Simulation methodologies for educating the engineers
    . Object oriented programming languages used in engineering education
    . Modeling and simulation research to advance engineering education
    . Simulation-based curricula for engineering education
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Schedule:
 August     26, 1991:   Deadline for program chair to receive four (4) 
			copies of the full papers
 September  30, 1991:   Notification of acceptance
 October    15, 1991:   Deadline for camera ready copy
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All submissions will be reviewed.  They must contain original contribution 
that has not been previously reported in the literature.  In addition to 
regular papers about 18 pages (double-spaced), the program committee may accept
additional papers either as short papers (about 8 pages double-spaced) or for
inclusion in a poster session.  Poster abstracts will appear in the 
proceedings.  Papers judged to be especially high in quality will be
submited for consideration by the Journal/Transactions of the Society 
for Computer Simulation International.  Submission with a cover letter stating
the name, address (postal and electronic), and phone number of each author 
should be sent to Hamid Vakilzadian, Program Chairman.

Hamid Vakilzadian, Program Chairman       Roy Crosbie, General Chairman
Department of Electrical Engineering      Department of Computer Engineering
University of Nebraska-Lincoln            California State University, Chico
Lincoln, NE 68588-0511                    Chico, CA 95929-0003
eerdvak@engvms.unl.edu                    crosbie@calstate.bitnet
Voice: (402) 472-1977                     Voice: (916) 898-4489/4654
Fax:   (402) 472-4732                     Fax: (916) 898-5995

Program Committee
Rassul Ayani, Royal Inst. of Tech., Sweden
Osman Balci, VPI, USA
John Ballard, U. of Nebraska, USA
Kallol Bagchi, Aalborg U., Denmark
Peter Breedveld, Tech. U. of Twente, Netherlands
William  L. Brogan, U. of Nevada, Las Vegas, USA
Francois E. Cellier, U. of Arizona, USA
H. Jurgen Halin, ETH-Swiss Inst. of Tech, Switzerland
Alfred Jones, Florida Atlantic Univ., USA 
Walter Karplus, UCLA, USA
Charles E. Knadler, IBM (Associate Program Chair), USA
Granino A. Korn, U. of Arizona , USA
George K. Lea, National Science Foundation, USA
Raymond F. Mignona, New York Inst. of Tech., USA
Zain Navabi, Northeastern Univ., USA
Don. J. Nelson U. of Nebraska, USA  
Tuncer Oren, Univ. of Ottawa, Canada
Alain Senteni, U. of Monteral, Canada
Micheal Singh, Cal. State Long Beach
Rodney, J. Soukup, U. of Nebraska, USA 
Ghislain Vansteenkiste, Univ. of Ghent, Belgium
George W. Zobrist, U. of Missouri, USA