jans@tekgvs.LABS.TEK.COM (Jan Steinman) (10/07/89)
<deanr@sco.COM (Dean Reece)> <The book uses 16k dynamic RAM in the CerDIP (Ceramic DIP package) and pops the top off by heating it with a soldering iron.> I've got about 50 of these. If anyone is serious enough about it to send me a SASE and a bit of anti-static foam, I'll send you one or two. I'd guess they're hard to find, being such ancient technology! Jan Steinman - N7JDB Electronic Systems Laboratory Box 500, MS 50-370, Beaverton, OR 97077 (w)503/627-5881 (h)503/657-7703