[sci.electronics] Wanted: process data for Intel i486

colin@cbnewsh.att.com (colin.alan.warwick) (07/26/90)

I am looking for data in the open literature on the process technology
used in the Intel i486(tm).  In particular I'd like die size, design
rule (feature and gap), number and function of the masks and a break
down of the component count.  Also what does the H in "CHMOS IV" mean?

Any data/references appreciated.

advTHANKSance

bkoball@cup.portal.com (Bruce R Koball) (08/03/90)

colin warwick writes:
I am looking for data in the open literature on the process technology
used in the Intel i486(tm).  In particular I'd like die size, design
rule (feature and gap), number and function of the masks and a break
down of the component count.  Also what does the H in "CHMOS IV" mean?

Any data/references appreciated.

advTHANKSance
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good luck in getting some of this info... it's considered very proprietary!
but there's a six foot composite plot in the visitor's lobby of Intel's
Santa Clara 4 building (2625 Walsh Ave) and rumor has it that a substantial
amount of this info can be gleened from the keys on it.
--------
p.s. the "H" stands for "High Performance"...just a trade mark gimic
-------
bkoball@cup.portal.com

bkoball@cup.portal.com (Bruce R Koball) (08/04/90)

An addendum to my posting re Colin Warwick's request for 486 process data:
I am reminded that it is generally known that the process is 1 micron,
double metal CMOS and that much of the other data Colin requested was
published in Intel's ICCD papers in 1989.

bkoball@cup.portal.com