jg90@castle.ed.ac.uk (J Gourlay) (12/06/90)
I was wondering if anyone has come across a particularly viscous,UV
curing glue for microelectronic chip packaging(glass to silicon).
Any info would be gratefully received as we are having great problems
with our current techniques.
James Gourlay
Dept.of Physics
University of Edinburgh
Mayfield Road
Edinburgh
Eh9 3JZ.
U.K.