MBALAMUT@USC-ECL.ARPA (10/23/85)
1986 Custon Integrated Circuits Conference
CALL FOR PAPERS
Rochester Riverside Convention Center, Rochester NY
May 12-14, 1986
The CICC'86 is sponsored by the IEEE Electron Devices Society, the IEEE
Solid-State Circuits Council. Its aim is to bring together designers,
producers, and users of custom ICs to discuss recent developments and
future directions in custom integrated circuits.
Original papers are solicited in the following areas as by relate to
custom devices and ICs:
CAD: device and process modeling, circuit simulation, logic simu-
ulation, fault grading, testability analysis, layout verification,
and VLSI design aids.
GATE ARRAYS, STANDARD CELL, and FULL CUSTOM ICs: tradeoffs and design
techniques, CMOS, NMOS, Bipolar, and GaAs.
APPLICATIONS: the application section will be focused on specific
areas each year. This year's topics will be Digital Signal Processing
ICs, and smart sensor ICs.
FRABICATION TECHNOLOGIES: silicon and non-silicon, mixed processes,
and direct wafer writing.
CUSTOM INTERFACES: voltage/current translators, fiber optic integrated
transceivers, etc.
PACKAGING: hybrids and custom interconnects, high speed/high power
packaging.
TESTING and RELIABILITY: design for testability, measurement
techniques.
TUTORIALS and PANEL DISCUSSIONS are planned. Send suggestions for
topics to Technical Program Chairman by September 15, 1985 at address
below.
EXHIBITS by custom IC companies, including workstations suppliers, will
run concurrently with the conference.
PROFESSIONAL EDUCATIONAL SEMINARS are scheduled for May 15, the day
following the conference.
INSTRUCTIONS TO AUTHORS
Authors are asked to submit sixty (60) copies of a 250-word summary,
including a 35-wird abstract representing original unpublished work
suitable for a 20-minute presentation. The summary and abstract must
include the specific new results that will reported. A carefully
written abstract is important since it will be used in the Conference
Program. One copy of additional supporting documentation, not to exceed
four pages, is encouraged. DEADLINE FOR SUBMISSION IS DECEMBER 2, 1985.
Papers received after December 2 will be considered late paper. THE
AUTHORS'S NAME, AFFILIATION, COMPLETE ADDRESS, AND TELEPHONE NUMBER MUST
APPEAR ON THE SUMMARY.
Notice of acceptance will be mailed by January 28, 1986. Authors of
accepted papers will be required to submit a manuscript by February 28,
1986 of up to four pages, including figures, in camera-ready format for
publication in the Conference Proceedings.
Late papers received by March 1, 1986, will be considered for a
10-minute presentation.
SUMMARIES AND ABSTRACTS SHOULD BE SENT TO: Mrs. Roberta Kaspar,
Executive Secretary CICC '86, 20 Ledgewood Drive, Rochester, NY 14615,
(716)865-7164. Other correspondence should be addressed to Dick Bryant,
Technical Program Chairman.
Technical Program Chairman
Dick Bryant
Ford Microelectronics, Inc,
10340 State Hwy. 83, MS-FMI
Colorado Springs, CO 80908-3699
(30) 528-7620
Further information may be obtained from:
Conference Chairman
Tom Foxall
Pacific Microcircuits Ltd.
240 H Street
P.O. Box F195-108
Blaine, WA 98230
(604)536-1886
Exhibits Chairman
David Lewis
Eastman Kodak Company
Research Labortories
Rochester, NY 14650
(716)477-7558